Product Name
Vx-MP
Description
Probe card that supports high-density flip chip wafer testing for devices such as microprocessors and SoCs. It is designed to provide high-signal fidelity and current-carrying capability, while delivering long product life with minimal maintenance.
Features include:
* 2D Vertical MEMS probe technology
* Ultra stable Cres on Cu bumps
* Proprietary CoolProbe technology to support extreme current requirements
* Low probe force to reduce bump damage
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